This two-month accelerated training program focuses on the critical intersection between semiconductor physics and high-power industrial engineering. Designed as an intensive, fast-tracked version of the standard curriculum, the course provides graduates from electrical, electronic, computer science, and applied physics disciplines with hands-on, industry-ready expertise. Over the course of eight weeks, participants will transition from foundational concepts of semiconductor devices to the practical integration of power electronics in real-world industrial systems, equipping them to meet the immediate demands of the global and local semiconductor ecosystems.
|
Code |
Unit of Competency |
Day |
Class no |
Topic |
Total Hours |
Lecture/Practice
|
|---|---|---|---|---|---|---|
|
BSIA-IT-PDII-01-O |
Power Semiconductor Devices & Switching |
Day 1 |
1 |
Introduction to Power Electronics and Component-Level Understanding. |
4 |
Lecture + Practice |
|
Day 2 |
2 |
MOSFETs and IGBTs: Structure, operation, and characteristics. |
4 |
Lecture + Practice |
||
|
Day 3 |
3 |
Diodes and thyristors: Operating principles and application domains. |
4 |
Lecture + Practice |
||
|
Day 4 |
4 |
Switching Behavior: Turn-on/off transients and loss analysis. |
4 |
Lecture + Practice |
||
|
Day 5 |
5 |
Efficiency Optimization: Conduction vs switching losses. |
4 |
Lecture + Practice |
||
|
Day 6 |
6 |
Device selection strategies for system efficiency. |
4 |
Lecture + Practice |
||
|
Day 7 |
7 |
Simulation of power devices (LTspice/MATLAB). |
4 |
Practice |
||
|
Day 8 |
8 |
Lab: Characterizing MOSFETs and reading datasheets. |
4 |
Practice |
||
|
Day 9 |
9 |
Lab: Characterizing IGBTs and safe operating areas (SOA). |
4 |
Practice |
||
|
Day 10 |
10 |
Review of component-level behavior and efficiency models. |
4 |
Lecture + Practice |
||
|
BSIA-IT-PDII-02-O |
Gate Drive Circuits & Thermal Management |
Day 11 |
11 |
Gate Drive Circuit Implementation: Isolated vs non-isolated drivers. |
4 |
Lecture + Practice |
|
Day 12 |
12 |
Bootstrapping techniques and power supply for gate drivers. |
4 |
Lecture + Practice |
||
|
Day 13 |
13 |
Gate resistor selection, Miller clamp, and parasitic effects. |
4 |
Lecture + Practice |
||
|
Day 14 |
14 |
Dead-time generation and shoot-through protection. |
4 |
Lecture + Practice |
||
|
Day 15 |
15 |
Thermal Management Proficiency: Heat dissipation basics. |
4 |
Lecture + Practice |
||
|
Day 16 |
16 |
Thermal resistance calculation and heat sink sizing. |
4 |
Lecture + Practice |
||
|
Day 17 |
17 |
Thermal interface materials (TIM) and active cooling methods. |
4 |
Lecture + Practice |
||
|
Day 18 |
18 |
Thermal protection strategies for high-power components. |
4 |
Lecture + Practice |
||
|
Day 19 |
19 |
Thermal simulation and profiling of power modules. |
4 |
Practice |
||
|
Day 20 |
20 |
Lab: Gate driver circuit design and thermal testing. |
4 |
Practice |
||
|
BSIA-IT-PDII-03-O |
Power Conversion System Design |
Day 21 |
21 |
Power Conversion System Design: Buck, Boost, Buck-Boost DC-DC. |
4 |
Lecture + Practice |
|
Day 22 |
22 |
Isolated DC-DC converters: Flyback and Forward topologies. |
4 |
Lecture + Practice |
||
|
Day 23 |
23 |
DC-AC Inverter fundamentals: Single-phase topologies. |
4 |
Lecture + Practice |
||
|
Day 24 |
24 |
Three-phase inverters and Sinusoidal PWM (SPWM) techniques. |
4 |
Lecture + Practice |
||
|
Day 25 |
25 |
Uninterruptible Power Supply (UPS) system architecture. |
4 |
Lecture + Practice |
||
|
Day 26 |
26 |
Inductor and transformer design for power converters. |
4 |
Lecture + Practice |
||
|
Day 27 |
27 |
Capacitor selection for input/output filtering and ripple reduction. |
4 |
Lecture + Practice |
||
|
Day 28 |
28 |
Closed-loop control implementation for DC-DC converters. |
4 |
Lecture + Practice |
||
|
Day 29 |
29 |
System-level simulation of inverter and UPS systems. |
4 |
Practice |
||
|
Day 30 |
30 |
Lab: Prototyping and testing a basic DC-DC converter. |
4 |
Practice |
||
|
BSIA-IT-PDII-04-O |
Control Integration & Renewable Apps |
Day 31 |
31 |
Control & Automation Integration: Interfacing power stages to MCUs. |
4 |
Lecture + Practice |
|
Day 32 |
32 |
Motor drive systems: BLDC and Induction motor control basics. |
4 |
Lecture + Practice |
||
|
Day 33 |
33 |
Industrial automation and energy management platforms. |
4 |
Lecture + Practice |
||
|
Day 34 |
34 |
Battery & Renewable Energy Applications: Charging topologies. |
4 |
Lecture + Practice |
||
|
Day 35 |
35 |
Battery Management Systems (BMS) fundamentals and protection. |
4 |
Lecture + Practice |
||
|
Day 36 |
36 |
Solar inverter integration and Maximum Power Point Tracking. |
4 |
Lecture + Practice |
||
|
Day 37 |
37 |
Grid-tied vs off-grid renewable energy system architectures. |
4 |
Lecture + Practice |
||
|
Day 38 |
38 |
Advanced control algorithms for power electronics. |
4 |
Lecture + Practice |
||
|
Day 39 |
39 |
Simulation of motor drives and BMS platforms. |
4 |
Practice |
||
|
Day 40 |
40 |
Lab: Implementing a basic MPPT algorithm or motor control loop. |
4 |
Practice |
||
|
BSIA-IT-PDII-05-O |
Practical Circuit Skills & Troubleshooting |
Day 41 |
41 |
Practical Circuit Skills: Schematic capture for power electronics. |
4 |
Lecture + Practice |
|
Day 42 |
42 |
PCB design rules for high current and high voltage traces. |
4 |
Lecture + Practice |
||
|
Day 43 |
43 |
Component footprinting, creepage, clearance, and 3D modeling. |
4 |
Lecture + Practice |
||
|
Day 44 |
44 |
Soldering, hardware assembly, and prototyping techniques. |
4 |
Practice |
||
|
Day 45 |
45 |
Testing & Troubleshooting: Measurement instrument familiarity. |
4 |
Lecture + Practice |
||
|
Day 46 |
46 |
Safe probing techniques for high voltage measurement. |
4 |
Practice |
||
|
Day 47 |
47 |
Using oscilloscopes for detailed switching analysis. |
4 |
Practice |
||
|
Day 48 |
48 |
Using multimeters and power analyzers for efficiency testing. |
4 |
Practice |
||
|
Day 49 |
49 |
Diagnosing and fixing faults in power electronics systems. |
4 |
Practice |
||
|
Day 50 |
50 |
EMI/EMC basics and mitigation in power electronics. |
4 |
Lecture + Practice |
||
|
BSIA-IT-PDII-06-O |
Value Chain & Capstone Project |
Day 51 |
51 |
Semiconductor Value Chain: Packaging and module assembly. |
4 |
Lecture + Practice |
|
Day 52 |
52 |
Testing/reliability of semiconductor manufacturing practices. |
4 |
Lecture + Practice |
||
|
Day 53 |
53 |
Capstone project kick-off: Spec review and architecture design. |
4 |
Practice |
||
|
Day 54 |
54 |
Capstone project: Power stage schematic and component selection. |
4 |
Practice |
||
|
Day 55 |
55 |
Capstone project: PCB layout, thermal considerations. |
4 |
Practice |
||
|
Day 56 |
56 |
Capstone project: Hardware assembly and initial bring-up. |
4 |
Practice |
||
|
Day 57 |
57 |
Capstone project: System testing, troubleshooting, and optimization. |
4 |
Practice |
||
|
Day 58 |
58 |
Industry Readiness: Best practices, resumes, mock interviews. |
4 |
Lecture + Practice |
||
|
Day 59 |
59 |
Final Project Presentation & Review. |
4 |
Report Submission |
||
|
Day 60 |
60 |
Final Assessment / Exam. |
4 |
Report Submission |